Applications
Six industries rely on Anpin's five chemistry platforms to meet thermal, mechanical, and process requirements at production scale.
| Component | Challenge | Material Type | Recommended Series |
|---|---|---|---|
| Battery pack | Thermal management and vibration damping under cyclic load | Thermal interface materials + structural adhesives | Thermal gap fillers & silicone adhesives |
| Battery cells | Cell-to-pack bonding, flame-retardant sealing | Flame-retardant silicone adhesives & sealants | RTV silicone adhesives, FR grade |
| BMS (Battery Management System) | PCB protection against moisture, dust and vibration | Conformal coatings + potting compounds | Silicone conformal coatings & potting gels |
| Drive motor | High-temperature thermal conductivity, electrical insulation | Thermally conductive potting compounds | Silicone potting compounds, thermally conductive |
| On-board charger | Heat dissipation, potting for power modules | Thermally conductive potting & gap fillers | Thermal gap pads & potting compounds |
| High-voltage connectors | Sealing, insulation, environmental resistance | Sealants & structural adhesives | Silicone sealants & structural adhesives |
Frequently Asked Questions
Electronics & Power
From consumer devices to industrial inverters, Anpin's potting, conformal coating, and thermal interface systems are qualified for power electronics assemblies that demand long service life under heat, humidity, and mechanical stress. Use this section to map the right chemistry to your module, board, or power-conversion assembly.
| Component | Challenge | Material Type | Recommended Series |
|---|---|---|---|
| Electronic assembly & PCB protection | Component bonding; moisture and corrosion protection | Silicone adhesive; silicone conformal coating; UV conformal coating | Bonding: AP-688; conformal coating: AP777; UV coating: AP-587 |
| Power devices & power supplies | Insulating potting; moisture protection; thermal bonding | Silicone potting compound; high thermal conductivity epoxy potting adhesive | Silicone potting: 905; epoxy potting: AP-9180 |
| Capacitor encapsulation | Electrical insulation; moisture protection | Epoxy potting compound; polyurethane potting compound | Epoxy: AP-9180; polyurethane: AP-9622 (BP series) |
| Chips & device thermal interfaces | Underfill; conductive coating; thermal gap filling | Low-temperature curing epoxy; conductive adhesive; thermal gel / putty | Underfill: AP-9170; conductive coating: AP-8122; thermal gap filling: AP-8120 (TP350) |
| Loudspeaker assembly | Component bonding; bottom sealing | UV / acrylic adhesive; water-based polyurethane adhesive; MS adhesive | UV / acrylic bonding: AP-9770; polyurethane: AP-9622; bottom sealing: AP-917 |
| Camera modules | Bonding; FPC reinforcement; module assembly | Low-temperature curing epoxy; flexible epoxy; AA process adhesive | Bonding: AP-9170; FPC reinforcement: AP-9180; AA assembly: AP-9170 (UV series) |
| Appliance components & equipment cabinets | Potting; electrical insulation; enclosure sealing | Humidifier: epoxy potting compound; cabinet: polyurethane foam adhesive | Humidifier: AP-9180 (CH1); cabinet: AP-9622 (P series) |
Frequently Asked Questions
Personal Care
Anpin's personal-care silicone raw materials — including volatile carriers, elastomer gels, and emulsifiers — are formulated for skincare, haircare, color cosmetics, and deodorant applications. This section will detail the recommended grade families per product format and sensory profile.
| Component | Challenge | Material Type | Recommended Series |
|---|---|---|---|
| Hair care | Conditioning; combability; antistatic control | Amino silicone oil emulsion / microemulsion | Emulsion: AP-680; Microemulsion: AP-690 |
| Skin care | Emulsification; film formation; moisturization | Silicone emulsifier; MQ silicone resin | Emulsifier: AP-6017 / AP-6038; Resin: AP-806 / AP-850 |
| Color cosmetics | Emulsification; film formation; pigment dispersion | Silicone emulsifier / pigment dispersant; MQ silicone resin | Emulsifier: AP-6017 / AP-6038; Pigment dispersion: AP-6038; Resin: AP-806 / AP-850 |
| Sun-care formulations | Emulsification; hydrophobic film formation | Silicone emulsifier; MQ silicone resin | Emulsifier: AP-6017 / AP-6038; Resin: AP-806 / AP-850 |
| Body wash | Product transparency | Amino silicone oil microemulsion | AP-690 |
| Antiperspirant formulations | Film formation; hydrophobicity | MQ silicone resin | AP-806 / AP-850 |
Frequently Asked Questions
Optic Communications
Optical modules, transceiver assemblies, and the boards that carry them depend on materials for heat spreading, board protection, and assembly bonding. This section will set out the material systems Anpin recommends for each of those positions in an optical assembly.
| Component | Challenge | Material Type | Recommended Series |
|---|---|---|---|
| Laser chips & laser diodes | Thermal management; mechanical stress; reliability | Chip underfill: low-temperature epoxy; thermal interface: thermal pad; diode bonding: epoxy structural adhesive | Chip underfill: AP-9170; thermal pad: Tc-Pad AP600; diode bonding: AP-9110 |
| Lenses & optical components | Optical performance; positioning accuracy; long-term stability | AA process adhesive | AP-9170 (UV series) |
| FPC reinforcement | Electrical safety; CTE matching; dispensing | Flexible epoxy adhesive; UV adhesive | Flexible epoxy: AP-9180; UV adhesive: AP-9170 |
| Optical-module housings | Moisture and dust protection; impact protection; corrosion resistance | Silicone adhesive sealant | AP-688 |
| EMI shielding & conductive connections | Conductivity; reworkability; conductive coating | EMI-shielding adhesive / conductive adhesive |
Frequently Asked Questions
AI & Big Data Servers
AI and big-data server platforms run sustained workloads across processors, memory modules, power delivery, and network cards. This section will set out the material systems Anpin recommends for heat spreading, board protection, and assembly bonding inside a server chassis.
| Component | Challenge | Material Type | Recommended Series |
|---|---|---|---|
| Server thermal management | Heat transfer; low contact thermal resistance; low compression stress | Silicone thermal gel | AP8120 |
| AI chip cooling | Heat dissipation; low thermal resistance | Thermal grease | 5XXX series |
Frequently Asked Questions
See how we work with each industry